Lenovo ThinkSystem SR675 V3 Server – System Overview
This machine can support up to 8x double-wide GPUs including the new NVIDIA H100 and L40 Tensor Core GPUs, or up to 4x SXM5 NVIDIA HGX H100 GPUs with NVLink connecting all GPUs. The NVIDIA HGXTM H100 GPUs’ heat is dissipated via a specialized closed-loop liquid-to-air heat exchanger that offers liquid cooling advantages of lower power consumption, quieter operation, and higher performance without requiring additional piping.
Up to 6x SD665 V3 dual node trays can fit inside a single 6U ThinkSystem DW612S enclosure. The enclosure houses up to 144 processors, 216 TB of DDR5 Memory, and up to 144x PCIe Gen5 x16 adapters on just two data center floor tiles with up to 6x chassis in a conventional 42U rack.
Base Module
- Up to 4x double-wide, full-height, full-length; FHFL GPUs; PCIe Gen5 x16
- Up to 8x 2.5” Hot Swap SAS/SATA/NVMe
Dense Module
- Up to 8x double-wide, full-height, full-length GPUs each PCIe Gen5 x16 on PCIe switch
- Up to 6x EDSFF E1.S NVMe SSDs or up to 4x EDSFF E3.S 1T NVMe HS SSDs
HGX Module
- NVIDIA HGXTM H100 4-GPU with 4x NVLink connected SXM5 GPUs
- Up to 4x 2.5” Hot Swap NVMe SSDs or up to 4x EDSFF E3.S 1T NVMe HS SSDs
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